ChipMOS is a Taiwan-based independent semiconductor outsourced assembly and testing (OSAT) provider. Customers — primarily fabless semiconductor companies and integrated device manufacturers — outsource the back-end stages of chip manufacturing to ChipMOS rather than building or maintaining their own facilities. ChipMOS earns fees for testing, assembling, and bumping chips on behalf of customers, who deliver wafers or dies to ChipMOS for processing. The business operates across four roughly equal service lines: memory and logic/mixed-signal testing (~24% of revenue), memory and logic/mixed-signal assembly (~29%), display driver IC (DDIC) assembly and testing (~25%), and wafer bumping (~23%). ChipMOS focuses on niche memory chips (DRAM, NOR/NAND Flash), display driver ICs, and logic/mixed-signal chips — not leading-edge logic processors. Its facilities are in Hsinchu and Tainan, Taiwan, and key customers include Micron, Nanya Technology, Winbond, Macronix, MediaTek, Novatek, and Himax. Profitability is highly sensitive to equipment utilization rates, ASP trends, gold prices (a key input for bumping and COF assembly), and NTD/USD FX movements. ChipMOS's growth priorities include capturing demand from the DDR4-to-DDR5 transition, growing its automotive display driver packaging business, and developing silver-alloy bump technology as a lower-cost alternative to gold bumping.